PCI-Express 3.0 Motherboard - Chipset Intel Z170

 Back  Motherboard  Next

Chipset Intel Z87 big jump compared to its predecessor Z77 chipset because it introduced support for higher speed interfaces and a multitude of programming technologies supported any part of the contents of the BIOS or blend in the operating system. Chipset Intel Z97 is an improved (refreshed) version of the 'Haswell' system based on the Z87 chipset. The existing possibilities predecessors are improving in version Z170, which features support for multiple PCI-e lanes and more USB ports of the new generation, so without some massive upgrades. The most important novelty is the support for advanced processors made in brand new 14 nm technology, 'Skylake' series of processors as successor of 'Broadwell' technology according to TICK-TOCK principe, one year (the Tick) sees a process shrink to smaller transistors and better efficiency, the next year (Tock) ushers in a brand new microarchitecture. Intel successfully stuck to the Tick-Tock model until Broadwell, where the shrink from 22 nm to 14 nm was heavily delayed. There's more news but the most important is better direct media interface (DMI), connection between the chipset and processor has been upgraded to version DMI 3.0, and support for DDR3 and DDR4 type of memory with dual memory controllers.

The basic concept is chipset shown in the following example in version for desktop PC.

Example XIII

In this example shown in the block diagram of the chipset Z170. Shown in the example motherboard supports Core i5 and Core i7 microprocessors of sixth generation, planned for the socket LGA 1151.

 Chipset Intel-Z170
Figure* 3.5.41 Block schema of Intel-Z170 / Die inside Processor. ( +/- )

Unlike 3.5.37c image, which shows a considerable bunch of transistors at map of processor die that are only strong microscope can distinguish (worse than well filled hamburger), the figure 3.5.41b illustrated a processor with removed casing on which one can see the fine structures of wires from the die of processor to pins. It is very interesting that Intel is offering no more own desktop motherboards, but relies on other manufacturers. Different manufacturers of computer equipment used in various ways presented products, but unlike the above described products following figures related to two simpler motherboards designed with the Z170 chipset.

 MSI 'Z170A PC MATE' motherboard
Figure* 3.5.42 MSI 'Z170A PC MATE' / GIBABYTE 'GA-Z170-D3H'. ( +/- )

Not shown ATX motherboards for the players, which support up to four graphics cards, but cheaper products that support of older PCI cards. Additional PCIe-PCI control integrated circuit allows the use of an older product available through standard PCI slots. However, it is unclear who will write the drivers for such cards for example. 'Windows 10' operating system. No animated descriptions of the individual components of the motherboard, because they can be easily compared to the previously described products. Comparison of these two products is shown in the following table.

Form Factor MSI 'Z170A PC MATE' - ATX (305.00 mm × 225.00 mm) - MB-1
GIBABYTE 'GA-Z170-D3H' - ATX (305.00 mm × 214.00 mm) - MB-2
 - 1 × 128 Mbit flash
 - 2 × 64 Mbit flash DualBIOS
 - ACPI 5.0, PnP 1.0a, SM BIOS 2.8
 - ACPI 5.0, PnP 1.0a, SM BIOS 2.7, DMI 2.7, WfM 2.0
with Intel® 64-bit
 - 6th generation of Intel® Core™ i7, i5, i3 processors
 - Intel® Pentium® processors (LGA1151 package)
 - Intel® Celeron® processors (LGA1151 package)
L3 cache varies with CPU type
Processor Istruction SET SSE4.2, AVX 2.0
Processor Lithography 14 nm
Processor TDP  - up to 91 W (Core i5-6600K, CPU 3.5 GHz, GPU 1.15 GHz, Skylake)
 - up to 91 W (Core i7-6700K, CPU 4.0 GHz, GPU 1.15 GHz, Skylake)
Processor socket LGA 1151
Memory  - 4 x DDR4 DIMM sockets supporting up to 64 GB of system memory
 - DDR4 3200(OC) / 3000(OC) / 2800(OC) / 2600(OC) /
    2400 / 2133 MHz modules

 - DDR4 3466(OC) / 3400(OC) / 3333(OC) / 3300(OC) / 3200(OC) /
    3000(OC) / 2800(OC) / 2666(OC) / 2400(OC) / 2133 MHz modules

 - Dual channel memory architecture
 - Support for non-ECC & ECC memory modules
    (ECC modules operate in non-ECC mode)
 - Support for Extreme Memory Profile (XMP) memory modules
Chipset & chips  - Intel® Z170 Express Chipset
 - ASMedia® I/O Controller Chip (PCI Express - PCI bridge)
 - NUVOTON® I/O Chip
 - iTE® Super I/O Chip
Chipset Lithography 22 nm
Chipset TDP 6 W
Display Multi-Graphics Technology:
 - 2-Way AMD® CrossFire™ technology
Integrated Graphics Processor:
 - D-Sub (VGA) port (1920x1200@60Hz)
 - DVI-D port (1920x1200@60Hz)
 - HDMI 1.4 version (4096x2160@24Hz)
 - Support for up to 3 displays at the same time
 - Maximum shared memory of 512 MB
Storage Interface Chipset:
 - 6 x SATA 6Gb/s connectors
 - Support for RAID 0, RAID 1, RAID 5, and RAID 10
 - 1 x M.2 slot
 - 1 x SATAe port
 - 3 x SATAe port
USB interfaces MB-1
 - 6 x USB 3.1 Gen1 ports (4 back ports, 2 matherboard headers)
 - 4 x USB 2.0 ports (matherboard headers)
ASMedia® chip:
 - 2 x USB 3.1 Gen2 ports on the back panel
 - 1 x USB 3.0 Type-C
 - 8 x USB 3.0 ports (4 back ports, 4 matherboard headers)
 - 4 x USB 2.0 ports (2 back ports, 2 matherboard headers)
 - 2 x USB 2.0 ports (matherboard headers)
Audio MB-1
 - Realtek® ALC887 Codec, 7.1-Channel High Definition Audio
 - Realtek® ALC1150 codec, 2/4/5.1/7.1-Channel High Definition Audio
 - Support for S/PDIF Out
LAN support  - 1 x Realtek® RTL8111H Gigabit LAN controller
 - 1 x Intel® GbE LAN chip (10/100/1000 Mbit)
Wireless support  - Not supported
Peripheral interfaces  - D-Sub port
 - DVI-D port
 - HDMI port
 - 1 x RJ-45 port
 - PS/2 keyboard port
 - PS/2 mouse port
 - 3 x audio jacks (Line In, Mic In, Line Out / Headphone)
 - 4 x USB 3.1 Gen1 ports ports
 - 2 x USB 3.1 Gen2 ports ports
 - PS/2 keyboard/mouse port
 - 6 x audio jacks
    (Center/Subwoofer Speaker Out, Rear Speaker Out,
      Side Speaker Out, Line In, Line Out, Mic In)
 - 4 x USB 3.0 ports
 - 2 x USB 2.0 ports
 - 1 x USB Type-C™ port, with USB 3.0 support
Operating System  - Windows 10 / Windows 8.1 / Windows 7 supported drivers

The connectors on the rear of the motherboard are physically similar. The connections shown in Figure 5.3.43 refer to the motherboard MSI 'Z170A PC MATE' and GIBABYTE 'GA-Z170-D3H' motherboard.

 Connectors at 'Z170A PC MATE'
Figure* 3.5.43 Connectors at 'Z170A PC MATE' & 'GA-Z170-D3H'. ( +/- )

If you are using multimedia to figure 5.3, there is no need to use a motherboard that supports all audio capabilities, but is suitable MSI motherboard, which in addition has a separate PS/2 ports for the mouse and keyboard are supported in BIOS and has advanced support for USB devices. BIOS (Basic Input and Output System ) records hardware parameters of the system in the CMOS on the motherboard. Its major functions include conducting the Power-On Self-Test (POST) during system startup, saving system parameters and loading operating system, and many setting options. BIOS includes a BIOS Setup program that allows the user to modify basic system configuration settings or to activate certain system features.

But thanks to advances in technology for new motherboards CMOS memory is quite an enabling expansion of standard features BIOS, which is reflected in the extension called UEFI. UEFI (Unified Extensible Firmware Interface) is the standard interface to the PC hardware and created to complement the BIOS. This standard was created by more than 140 technology companies in a consortium for UEFI, including Microsoft. It was created to enhance the interoperability of software and overcomes the limitations of the BIOS. Some of the benefits of UEFI include: better security with protection of the process before starting the system, faster boot and resume from hibernation, support for drives with capacities of more than 2.2 terabyte (TB), and support for modern device drivers. In the previous chapter shows more about the described expansion BIOS.


Size elementary transistor becomes smaller, the concept of working transistors are improving, but it is getting harder existing technology to make further reducing its size. The transition from 22 nm technology to 14 nm technology primarily relates to the physical reduction of an existing design, and next-generation microprocessors followed the ritual of to Intel should be 14 nm microprocessors with improved technologies, better energy efficiency and a new way of packaging (new socket). Intel has long been used as described principle called 'tick-tock model'. Thus, the first phase of 14 nm chip-making to be a 'collapse' models from the second stages in the previous 22 nm technology with the introduction of new features, and thus follows new architecture in the 14 nm process.

 Tick-Tock model

As the microprocessor than their preceding models already pretty reduced it is expected that the chipset moved to a socket with a microprocessor (similar concept in Figure 3b in the Chapter of chip), and at the next phase may become an integral part of the architecture of microprocessor.

In chapter 4.6.2 shows one simple, stable and reliable motherboard with the graphics card of the middle class and not very powerful processor offers the user very acceptable results. Built-in modified version of z170 PCH manufactured in 22 nm technology, for the new series of processors 'Intel Skylake-S IMC', which with a lot of unexpected good features supporting DDR4 SDRAM type of memory.


 Content - Home
 Content  Informatics Alphabet
Citing this page:
Radic, Drago. " IT - Informatics Alphabet " Split-Croatia.
{Date of access}. <http://www.informatics.buzdo.com/>.
Copyright © by Drago Radic. All rights reserved. | Disclaimer